... Under transient high-load conditions, aggressive thermal cycling drives solder delamination and wire bond liftoff. legacy geometry manufacturing simply cannot resolve this without inflating system pressure drop. The Addireen AM Solution: We fabricate monolithic pure copper (~400 W/m K) EV Power Module heat sink via Green Laser PBF. By integrating teardrop and interlaced fins topologies, we strictly reduce localized flow drag. Joint Benchmarking (Same Spatial Footprint & Mass Flow Rate): >10 C reduction in max overall temperature. Mitigated thermal ... ... fatigue accumulation. Review the complete geometry analysis and empirical data in our latest release. Download the full white paper: https://www.addireennow.com/en/g... #ThermalManagement #EVPowerElectronics #IGBT #SiC #CopperAM

... optical transceivers scale from 1.6T to 3.2T, heat flux climbs while the module footprint remains fixed. Conventional die-cast housings are hitting their cooling limits. Addireen s approach: Fabricate the transceiver housing as a single pure copper component using Green Laser AM. By integrating staggered short-fin arrays directly into the casing, we eliminate thermal interface resistance entirely. Testing confirmed a 4 C drop in baseline temperature (52 C 48 C) with zero change to the module footprint ... ... Review the complete test methodology and geometry data in our latest white paper. Download the full white paper: https://www.addireennow.com/en/g... #ThermalManagement #OpticalTransceiver #PureCopper #GreenLaser #AdditiveManufacturing #DataCenter #CopperAM

... built our technical foundation by mastering the highly-reflective material first: Pure Copper. Using specialized Green Laser systems, we solved the high-reflectivity challenge to deliver 99.8% relative density for pure copper