Under transient high-load conditions, aggressive thermal cycling drives solder delamination and wire bond liftoff. legacy geometry manufacturing simply cannot resolve this without inflating system pressure drop.
The Addireen AM Solution:
We fabricate monolithic pure copper (~400 W/m K) EV Power Module heat sink via Green Laser PBF. By integrating teardrop and interlaced fins topologies, we strictly reduce localized flow drag.
As optical transceivers scale from 1.6T to 3.2T, heat flux climbs while the module footprint remains fixed. Conventional die-cast housings are hitting their cooling limits.
Addireen s approach: Fabricate the transceiver housing as a single pure copper component using Green Laser AM. By integrating staggered short-fin arrays directly into the casing, we eliminate thermal interface resistance entirely.
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Mass capacity powered by 100+ industrial systems.
End-to-end solutions: from DfAM to post-processing and QA.
Mastering core metals: Ti6Al4V, aluminum, pure copper and its alloys.
Strict QA: CMM, NDT, mechanical, leak testing & custom validation.
