📄 White Paper Vol. 4 | Pure Copper AM for Optical Transceiver Thermal Management Applications

As optical transceivers scale from 1.6T to 3.2T, heat flux climbs while the module footprint remains fixed. Conventional die-cast housings are hitting their cooling limits.

Addireen’s approach: Fabricate the transceiver housing as a single pure copper component using Green Laser AM. By integrating staggered short-fin arrays directly into the casing, we eliminate thermal interface resistance entirely.

Testing confirmed a 4°C drop in baseline temperature (52°C → 48°C) with zero change to the module footprint. Review the complete test methodology and geometry data in our latest white paper.

📥 Download the full white paper: https://www.addireennow.com/en/green-laser-copper-thermal-management/ad64d.html

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